Silver sintering wire-bonding less power module for high temperature applications
Affiliations : 1 - Laboratoire IMS (France), 2 - Microsemi Power Module Products (France), 3 - Alpha (États-Unis)
Intégration de puissance et architecture
Session : SP-J2-B "Intégration de puissance et architecture"
Integrity of the power module is mainly provided by interconnections between the different components. Due to RoHS restrictions, conventional lead-based solders cannot be used anymore. New solutions of die-attach have been investigated such as transient liquid phase bonding or silver sintering which is currently the most advanced alternative technology. Furthermore, the increase of electrification in transportation system requires a high thermal management because power electronics systems can be located in severe thermal environment and have to dissipate high self-heating. Double-side cooling power modules do not use wires bonding anymore, highly responsible for many failures. To match such requirements, a new structure combining silver sintering and double side cooling system has been developed and characterized. A prototype of a wireless single-phase bridge rectifier has been investigated.